High Aspect ATE Boards
R&D Circuits is a leading supplier of A.T.E. product to some of the largest semiconductor manufacturers and the largest fabless semicondutor companies in the world. R&D began manufacturing Test Interface Boards almost 20 years ago and it has been a core competency of our company for the past 15 years. To that effect, R&D Circuits has planned it's Design, Manufacturing and Assembly facilities capabilitites expressly to support the needs of our A.T.E. Customers.
We utilize the most commonly asked for software packages for A.T.E. board design in order to support your company in the format that best suites it's needs.
Our production facility has maintained and purchased new equipment to steadfastly meet the needs for the challenges facing our customers today and exceed them by planning for the needs of tommorow.
Current A.T.E. Challenges
High Aspect Ratio- R&D Circuits regularly manufactures boards with aspect ratio's of 25:1. This has become a proven technology. R&D Circuits has expanded our high speed drilling capabilitities and capacity with multiple high speed drill machines. X-ray drilling and laser drilling and routing. Aspect Ratio's are available beyond 30:1 but R&D recommends utilizing our expert engineering staff for assistance to design for the best possible manufactuirng yields to maintain good yields and competitive pricing.
Fine Pitch Devices- R&D Circuits is currently manufacturing .4mm boards on a regular basis for pin counts up to 300. Alternative technolgies are available for fine pitch device testing as well. Please see the site section for Space Transformers and Interposers for more information.
High Speed /Low Loss Challenges: R8d Circuits Successfully manufactures hgih speed A.T.E. product beyond 40 Ghz though sophisticated etching equipment, impedance software and high temperture press's, all of which affect a manufacturers ability to control impedance.
Assembly: R&D Circuits has expanded the capabilitite of their assembly facility to reliably manufacture and AUTOMATE the assembly of A.T.E. boards in panel sizes up to 24" x 36" and thickness's up to .350, while holding down to 15 micron's of accuracy. With full BGA and BGA X-ray capabilitites and automated pick and place generated from your CAD data R&D Assembly can ensure a flawlessly assembly product ready to load on your tester upon delivery.
This allows us to give you reliably assembled product in A.T.E. prodcution quantities up to 15 load boards per day to keep your production test floor up and running non-stop.